Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC – Get Free Report) announced a quarterly dividend on Thursday, March 6th, RTT News reports. Investors of record on Thursday, March 20th will be paid a dividend of 0.205 per share by the semiconductor company on Tuesday, April 8th. This represents a $0.82 annualized dividend and a dividend yield of 2.23%. The ex-dividend date is Thursday, March 20th.
Kulicke and Soffa Industries has raised its dividend payment by an average of 10.9% annually over the last three years. Kulicke and Soffa Industries has a payout ratio of 36.3% indicating that its dividend is sufficiently covered by earnings. Research analysts expect Kulicke and Soffa Industries to earn $1.73 per share next year, which means the company should continue to be able to cover its $0.82 annual dividend with an expected future payout ratio of 47.4%.
Kulicke and Soffa Industries Stock Up 0.3 %
Shares of KLIC opened at $36.85 on Tuesday. The firm has a market cap of $1.97 billion, a price-to-earnings ratio of 307.08 and a beta of 1.38. The company’s fifty day moving average is $42.05 and its 200-day moving average is $44.36. Kulicke and Soffa Industries has a 12 month low of $35.04 and a 12 month high of $53.71.
Analyst Ratings Changes
KLIC has been the topic of a number of recent analyst reports. Needham & Company LLC reissued a “buy” rating and issued a $53.00 price objective on shares of Kulicke and Soffa Industries in a research note on Thursday, February 6th. StockNews.com upgraded Kulicke and Soffa Industries from a “sell” rating to a “hold” rating in a research report on Thursday, February 6th. Three analysts have rated the stock with a hold rating and three have issued a buy rating to the stock. According to data from MarketBeat.com, the stock has a consensus rating of “Moderate Buy” and a consensus target price of $52.00.
View Our Latest Analysis on KLIC
About Kulicke and Soffa Industries
Kulicke and Soffa Industries, Inc designs, manufactures, and sells capital equipment and tools used to assemble semiconductor devices. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company offers ball bonding equipment, wafer level bonding equipment, wedge bonding equipment; and advanced display, die-attach, and thermocompression systems and solutions, as well as tools, spares and services for equipment.
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