Park-Ohio Holdings Corp. (NASDAQ:PKOH) Announces Quarterly Dividend of $0.13

Park-Ohio Holdings Corp. (NASDAQ:PKOH) announced a quarterly dividend on Thursday, April 17th, RTT News reports. Investors of record on Friday, May 2nd will be paid a dividend of 0.125 per share by the industrial products company on Friday, May 16th. This represents a $0.50 annualized dividend and a yield of 2.66%.

Park-Ohio has a dividend payout ratio of 14.2% meaning its dividend is sufficiently covered by earnings.

Park-Ohio Price Performance

Shares of Park-Ohio stock opened at $18.80 on Friday. Park-Ohio has a 12 month low of $18.00 and a 12 month high of $34.50. The stock has a market capitalization of $267.51 million, a P/E ratio of 15.04 and a beta of 1.10. The business has a 50 day simple moving average of $22.06 and a two-hundred day simple moving average of $26.24. The company has a debt-to-equity ratio of 1.90, a current ratio of 2.45 and a quick ratio of 1.26.

Insider Buying and Selling at Park-Ohio

In related news, Director Edward F. Crawford sold 22,500 shares of Park-Ohio stock in a transaction that occurred on Wednesday, March 12th. The shares were sold at an average price of $21.63, for a total value of $486,675.00. Following the completion of the sale, the director now owns 766,273 shares in the company, valued at approximately $16,574,484.99. This trade represents a 2.85 % decrease in their position. The transaction was disclosed in a document filed with the Securities & Exchange Commission, which is accessible through this link. 33.04% of the stock is currently owned by corporate insiders.

Analysts Set New Price Targets

Separately, StockNews.com cut shares of Park-Ohio from a “buy” rating to a “hold” rating in a research report on Thursday, March 13th.

About Park-Ohio

Park-Ohio Holdings Corp. provides supply chain management outsourcing services, capital equipment, and manufactured components in the United States, Europe, Asia, Mexico, Canada, and internationally. It operates through three segments: Supply Technologies, Assembly Components, and Engineered Products.